Ou H.-FLin Y.-KHsueh C.-H.CHUN-HWAY HSUEH2022-03-222022-03-22202107437463https://www.scopus.com/inward/record.uri?eid=2-s2.0-85113367543&doi=10.1021%2facs.langmuir.1c01611&partnerID=40&md5=665da0c9b7ff0189655dac67c75e4c16https://scholars.lib.ntu.edu.tw/handle/123456789/598354We implemented the fabrication of hybrid structures, including pyramids, etching holes, and inverted pyramidal cavities on silicon substrates, by three-step chemical etching. To achieve this, we utilized anisotropic wet etching as the first-step etching to form pyramids of various sizes. Subsequently, metal-assisted chemical etching was performed to develop aligned etching holes on the pyramidal structure. Ultimately, anisotropic wet etching was used again as the third-step etching for the etchant to penetrate holes to form inverted pyramidal cavities. Optimizing the three-step etching treatments, large-scale textured structures with low reflectance could be obtained, and they show potential for applications in sensors, solar cells, photovoltaics, and surface-enhanced Raman scattering (SERS). Examples of using the textured silicon substrates for SERS applications were given. ? 2021 American Chemical Society.AnisotropyOptical propertiesRaman scatteringSiliconSolar power plantsSubstratesSurface scatteringTexturesAnisotropic wet etchingEtching treatmentHybrid structureMetal-assisted chemical etchingPyramidal structuresSilicon substratesStructural and optical propertiesSurface enhanced Raman Scattering (SERS)Wet etching[SDGs]SDG7Structural and Optical Properties of Textured Silicon Substrates by Three-Step Chemical Etchingjournal article10.1021/acs.langmuir.1c01611343287432-s2.0-85113367543