陳炳煇臺灣大學：機械工程學研究所陳威廷Chen, Wei-TingWei-TingChen2007-11-282018-06-282007-11-282018-06-282005http://ntur.lib.ntu.edu.tw//handle/246246/61605This study aims to design and develop a CMOS sensor chip for measuring thermal conductivity of liquids. The CMOS sensor chip is realized by VIS 0.5 μm 2P3M CMOS process with maskless post-CMOS micromachinings. The procedure used to measure thermal conductivity of liquids here is utilized to replace conventional methods which require a great deal of specimen and cost a long measurement time. The measurement system consists of a heater at the center, four pairs of temperature sensors, specimen of liquid drop and a cavity for thermal insulation. Once a heat flux is applied by the heater, it will cause temperature variations of the sensor. Different kinds of tested liquids will result in different temperature variations of the sensor. The temperature variation will correspond to the resistance variation of temperature sensors. Four kinds of liquids are used to measure in the thesis. The conclusions of experiment results are as follows: a liquid with higher thermal conductivity results in a smaller resistance variation of the temperature sensor. In addition, an experiment system will have a larger time constant as a liquid with higher thermal conductivity is tested. Thermal conductivities of other liquids could be measured as well based on a relation between thermal conductivity and time constant was established by the measuring procedure in the thesis.Table of Contents Acknowledgement I Abstract II Table of Contents IV List of Tables VII List of Figures VIII Chapter 1 Introduction 1 1.1 General Remarks 1 1.1.1 Thermal conductivities of liquids 1 1.1.2 CMOS-MEMS fabrication technology 1 1.2 Literature Survey 2 1.2.1 A transient hot-wire method 3 1.2.2 A transient hot-disk method 4 1.2.3 CMOS-MEMS fabrication technologies 6 1.3 Motivation and Objectives 6 1.4 Thesis Organization 8 Chapter 2 Design Principle 10 2.1 Principles of the CMOS Sensor 10 2.2 Design of the CMOS Sensor Chip 11 2.2.1 CMOS 0.5μm 2P4M whole chip layout 12 2.2.2 Subsystems of the CMOS sensor chip 12 Chapter 3 Post-CMOS Micromachining 16 3.1 Post-CMOS Micromachining Process Flow of the CMOS Sensor Chip 16 3.2 Isotropic Wet Etching for Removing Metal Layers 18 3.3 Anisotropic Dry Etching for Removing Silicon Dioxide 19 3.4 Anisotropic Wet Etching for removing silicon substrate 21 3.5 Anisotropic Dry Etching for opening pads 23 3.6 Wire bonding 24 Chapter 4 Experimental Apparatus and Procedures 25 4.1 Experimental Apparatus 25 4.2 Tested Liquids 26 4.3 Experimental Procedures 27 4.3.1 Procedure of resistance versus temperature calibration 27 4.3.2 Procedures of measuring thermal conductivity of tested Liquids 28 Chapter 5 Experimental Results and Discussions 30 5.1 Experimental Results of Different Tested Liquids 30 5.2 Experimental Results Comparison of Different Tested Liquids 32 5.3 Uncertainty Analysis 33 Chapter 6 Conclusions and Future Prospects 35 References 602018461 bytesapplication/pdfen-US熱傳導係數互補式金氧半感測晶片後製程Thermal conductivityCMOS sensor chipPost-CMOS Micromachiningthesishttp://ntur.lib.ntu.edu.tw/bitstream/246246/61605/1/ntu-94-R92522105-1.pdf