Su, L.-Y.L.-Y.SuHuang, H.-H.H.-H.HuangLin, Y.-C.Y.-C.LinChen, G.-L.G.-L.ChenWEN-CHANG CHENChen, W.W.ChenWang, L.L.WangCHU-CHEN CHUEH2021-08-052021-08-0520211616301Xhttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85092712485&doi=10.1002%2fadfm.202005753&partnerID=40&md5=cdac837d63c5fabc354aace309a4caa9https://scholars.lib.ntu.edu.tw/handle/123456789/577238Herein, interfacial engineering is demonstrated to improve the thermal stability of non-fullerene bulk-heterojunction (BHJ) OPVs to a practical level. An amphiphilic dendritic block copolymer (DBC) is developed through a facile coupling method and employed as the surface modifier of ZnO electron-transporting layer in inverted OPVs. Besides showing distinct self-assembly behavior, the synthesized DBC possesses high compatibility with plasmonic gold nanoparticles (NPs) due to the constituent malonamide and ethylene oxide units. The hybrid DBC@AuNPs interlayer is shown to improve device's performance from 14.0% to 15.4% because it enables better energy-level alignment and improves interfacial compatibility at the ZnO/BHJ interface. Moreover, the DBC@AuNPs interlayer not only improves the interfacial thermal stability at the ZnO/BHJ interface but also endows a more ideal BHJ morphology with an enhanced thermal robustness. The derived device reserves 77% of initial PCE after thermal aging at 65 °C for 3000 h and yields an extended T80 lifetime of >1100 h when stored at a constant thermal condition at 65 °C, outperforming the control device. Finally, the device is evaluated to possess a T80 lifetime of over 1.79 years at room temperature (298 K) when stored in an inert condition, showing great potential for commercialization. ? 2020 Wiley-VCH GmbHBlock copolymers; Ethylene; Fullerenes; Gold nanoparticles; Heterojunctions; II-VI semiconductors; Morphology; Organic solar cells; Oxide minerals; Plasmonic nanoparticles; Self assembly; Synthesis (chemical); Thermal aging; Thermodynamic stability; Zinc oxide; Bulk heterojunction (BHJ); Electron transporting layer; Energy level alignment; Interfacial compatibility; Interfacial thermal stability; Self-assembly behaviors; Surface modifiers; Thermal condition; Thermal Engineering[SDGs]SDG7journal article10.1002/adfm.2020057532-s2.0-85092712485