郭瑞祥2006-07-252018-06-292006-07-252018-06-292001http://ntur.lib.ntu.edu.tw//handle/246246/3034本計劃發展整合檢測與控制技術,其中包 含了離線製程最佳化技術與線上製程控制技 術。藉由整合機台、製程、材料與晶圓的資料 收集,決策分析與執行,以改善機台與製程的 表現 。 在第一年中,我們發展了合理分群技術以 建立了快速熱氧化製程之非均勻度統計模型。 在第二年中,我們發展了自我調適督導控制技 術 。 第三年重點為製程整合檢測與控制,具體 的工作項目包含了 : 1. 發展整合檢測與控制技 術 2. 建立整合檢測系統雛 型 3. 進行資料分 析 目前第三年的目標均已完成,我們已發展 了整合檢測與控制技術,並且建立了整合檢測 系統雛型。運用時間序列與多變量統計之技 術,我們建立了及時機台資料之模型,以作 為 線上機台監控之用 。The goals of this three-year project are to develop integrated inspection and control schemes for semiconductor cluster tools, which include off-line process optimization and on-line process control techniques. In the first year, we have developed rational subgrouping technique for modeling the oxide thickness non-uniformity of the rapid thermal cluster tool. In the second year, we then developed the on-line supervisory control technique. The tasks of the third year include: 1) to develop integrated inspection and control methodology 2) to construct an integrated inspection system prototype and 3) to conduct data analysis. Currently the tasks are all completed. The proposed integrated inspection methodology is developed and the equipment monitoring system prototype is constructed. Time-series modeling and multivariate statistics are used to model the real-time equipment data for on-line monitoring purpose.application/pdf225118 bytesapplication/pdfzh-TW國立臺灣大學工商管理學系統計製程管制督導控制及時機台監控statistical process controlsupervisory controlreal-time equipment monitoring具網路結合功能之半導體製造集結式機台─子計畫四:半導體集結式機台整合檢測與控制(3/3)Integrated Inspection and Control for Semiconductor Cluster Tools(3/3)reporthttp://ntur.lib.ntu.edu.tw/bitstream/246246/3034/1/892218E002055.pdf