Combination of Finite Element Analysis with Accelerated Life Testing in Studying the Reliability of Electronic Packaging

Wu, W.F.W.F.WuChen, S.L.S.L.ChenChou, P.L.P.L.Chou2019-07-302019-07-302013https://scholars.lib.ntu.edu.tw/handle/123456789/415546Combination of Finite Element Analysis with Accelerated Life Testing in Studying the Reliability of Electronic Packagingconference paper