Wu, Chia-YiChia-YiWuChao, Tien ShengTien ShengChaoYI-CHIA CHOU2023-10-252023-10-252023-01-01https://scholars.lib.ntu.edu.tw/handle/123456789/636518Co-integration of gallium nitride (GaN) power devices with Si logic ICs provides a way of applying high power and high efficiency circuits on a single chip. In order to co-integrate GaN devices with Si ICs, an ohmic contact for GaN devices has to be Si compatible and durable at the same or higher temperature of the back-end process in the conventional complementary metal oxide semiconductor (CMOS) industry. In this work, an Au-free ohmic junction with high thermal stability for AlGaN/GaN high electron mobility transistors (HEMTs) was presented. The proposed titanium nitride (TiN) contacts on AlGaN/GaN HEMTs retained their ohmic characteristics and stayed stable at temperatures even higher than 1000 °C. The interface chemistry analysis using STEM EELS revealed the enhancement of the binding energy of Ga-N and Al-N and invisible diffusion of Ti during treatment below 1000 °C. This clarifies the origin of the highly stable ohmic contact. Thus, our work provides a new pathway and thought for forming reliable contacts for HEMTs or another GaN-based devices.enjournal article10.1039/d3na00491k377670462-s2.0-85171645284https://api.elsevier.com/content/abstract/scopus_id/85171645284