Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints

Lin Y.L.Chang C.W.Tsai C.M.Lee C.W.C. ROBERT KAO2019-11-272019-11-27200603615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-33745085927&doi=10.1007%2fBF02692561&partnerID=40&md5=8c30ca433e087ec1a14487e0b77dd1ebhttps://scholars.lib.ntu.edu.tw/handle/123456789/432705Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder jointsconference paper10.1007/BF026925612-s2.0-33745085927