Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish

Liu, C. M.C. M.LiuHo, C. E.C. E.HoChen, W. T.W. T.ChenKao, and C. R.and C. R.Kao2010-09-032018-06-282010-09-032018-06-282001-09http://ntur.lib.ntu.edu.tw//handle/246246/198868en-USReflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finishjournal article