Interfacial reactions and electromigration in flip-chip solder joints

Ho C.E.Kao C.R.Tu K.N.C. ROBERT KAO2019-11-272019-11-272013978144195768914419576779781441957672https://www.scopus.com/inward/record.uri?eid=2-s2.0-84907657767&doi=10.1007%2f978-1-4419-5768-9_11&partnerID=40&md5=7bcb80a7a4ccb7cd1fa05380c971fda7https://scholars.lib.ntu.edu.tw/handle/123456789/432624[SDGs]SDG10Interfacial reactions and electromigration in flip-chip solder jointsbook part10.1007/978-1-4419-5768-9_112-s2.0-84907657767