Study of UBM consumption in flip chip solder joints under varied extra-high current density with local temperature control

Yang T.L.C. ROBERT KAO2019-11-272019-11-2720109781424497836https://www.scopus.com/inward/record.uri?eid=2-s2.0-79951596198&doi=10.1109%2fIMPACT.2010.5699571&partnerID=40&md5=836b94f1400098065585cb2948cd99cahttps://scholars.lib.ntu.edu.tw/handle/123456789/432654Study of UBM consumption in flip chip solder joints under varied extra-high current density with local temperature controlconference paper10.1109/IMPACT.2010.56995712-s2.0-79951596198