Chen G.-RTuan W.-H.WEI-HSING TUAN2022-03-222022-03-2220221546542Xhttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85113299597&doi=10.1111%2fijac.13859&partnerID=40&md5=4b94225ada31557cddb59ded764ab67ahttps://scholars.lib.ntu.edu.tw/handle/123456789/598494In the present study, the thermal characteristics of spinel ferrites are reported. The thermal expansion coefficient of ferrites is slightly larger than that of silicon; furthermore, these ferrites all demonstrate capability to absorb microwave. Nevertheless, their thermal conductivity is relatively low. A copper plate is bonded to ferrite to provide a backing for heat spreading. Microstructure observation at the interface reveals no reaction phase. The thermal resistance at the copper-ferrite interface is low. With the bonding of metallic copper, the heat generated in ferrites by microwave absorbing is possible to be removed by the backing copper layer. ? 2021 The American Ceramic Society (ACERS)Copper alloysCopper metallurgyFerriteFerritesThermal expansionCopper ferritesHeat spreadingMetallic copperMicrostructure observationMicrowave absorbingSpinel ferritesThermal characteristicsThermal expansion coefficientsThermal conductivityjournal article10.1111/ijac.138592-s2.0-85113299597