Yu, Chia-ChiChia-ChiYuHSIN-JAY WUAgne, Matthias T.Matthias T.AgneWitting, Ian T.Ian T.WittingDeng, Ping-YuanPing-YuanDengSnyder, G. JeffreyG. JeffreySnyderChu, Jinn P.Jinn P.Chu2024-09-182024-09-182019https://www.scopus.com/record/display.uri?eid=2-s2.0-85060438127&origin=resultslisthttps://scholars.lib.ntu.edu.tw/handle/123456789/721171論文編號: 13001The thin film metallic glass (TFMG) is an effective diffusion barrier layer for PbTe-based thermoelectric (TE) modules. Reaction couples structured with Cu/TFMG/PbTe are prepared via sputter-deposition and are annealed at 673 K for 8-96 h. The transmission line method is adopted for the assessment of electrical contact resistivity upon the PbTe/TFMG, and the value remains in the range of 3.3-2.5 × 10 −9 (Ω m 2 ). The titanium-based TFMG remains amorphous upon annealing at 673 K for 48 h and effectively blocks the inter-diffusion by not having grain-boundaries, which only allows the bulk diffusion between the metal electrode and the TE substrate. © 2019 Author(s).journal article10.1063/1.50468262-s2.0-85060438127