Chuang, T.H.T.H.ChuangTsao, L.C.L.C.TsaoChung, Chien-HanChien-HanChungChang, S.Y.S.Y.ChangChuangTH2012-10-242018-06-282012-10-242018-06-282012http://ntur.lib.ntu.edu.tw//handle/246246/243564en-USEvolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and agingjournal article10.1016/j.matdes.2012.03.021http://ntur.lib.ntu.edu.tw/bitstream/246246/243564/-1/04.pdf