Reliable Microjoints Formed by Solid-Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture

Chang, Jing-YaoJing-YaoChangCheng, Ren-ShinRen-ShinChengKao, Kuo-ShuKuo-ShuKaoChang, Tao-ChihTao-ChihChangChuang, Tung-HanTung-HanChuang2012-10-242018-06-282012-10-242018-06-282012http://ntur.lib.ntu.edu.tw//handle/246246/243586en-USReliable Microjoints Formed by Solid-Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecturejournal article10.1109/TCPMT.2012.2190290http://ntur.lib.ntu.edu.tw/bitstream/246246/243586/-1/26.pdf