Role of minor Zn addition in the interfacial reaction between lead-free solders and Cu

Yang S.C.C. ROBERT KAO2019-11-272019-11-2720079781424416370https://www.scopus.com/inward/record.uri?eid=2-s2.0-48649091760&doi=10.1109%2fIMPACT.2007.4433577&partnerID=40&md5=be30401f6e4fed805486a46090c0d333https://scholars.lib.ntu.edu.tw/handle/123456789/432691[SDGs]SDG9Role of minor Zn addition in the interfacial reaction between lead-free solders and Cuconference paper10.1109/IMPACT.2007.44335772-s2.0-48649091760