Chen, Sinn-wenSinn-wenChenZi, An-renAn-renZiChen, Po-yinPo-yinChenHSIN-JAY WUChen, Yu-kaiYu-kaiChenWang, Chao-hongChao-hongWang2024-09-182024-09-182008https://www.scopus.com/record/display.uri?eid=2-s2.0-44249112321&origin=resultslisthttps://scholars.lib.ntu.edu.tw/handle/123456789/721203Sn-Sb and Sn-Sb-based alloys are important high temperature solders. Interfacial reactions are examined in the Sn-5.0 at% Sb/Ag and Sn-10.0 at% Sb/Ag at 200 °C, and Sn-5.0 at% Sb/Cu and Sn-10.0 at% Sb/Cu at 250 °C. Only the Ag3Sn phase is formed in the Sn-Sb/Ag couples, and Cu6Sn5 and Cu3Sn phases are formed in the Sn-Sb/Cu couples. The reaction products all grow linearly with the square root of reaction time which suggests the interfacial reactions are diffusion controlled. © 2008 Elsevier B.V. All rights reserved.AgCuInterfacial reactionsSn-Sbjournal article10.1016/j.matchemphys.2008.04.0182-s2.0-44249112321