Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer

Chuang, Tung-HanTung-HanChuangLin, Hsiu-JenHsiu-JenLinTsao, Cheng-WenCheng-WenTsao2009-01-062018-06-282009-01-062018-06-282006http://ntur.lib.ntu.edu.tw//handle/246246/95958application/pdf192934 bytesapplication/pdfen-USIntermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayerjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95958/1/100.pdf