Thermal stress aware design for stacking IC with through glass via

Chien, J.-H.J.-H.ChienYu, H.H.YuLung, C.-L.C.-L.LungChang, H.-C.H.-C.ChangTsai, N.-Y.N.-Y.TsaiChou, Y.-F.Y.-F.ChouChen, P.-H.P.-H.ChenChang, S.-C.S.-C.ChangKwai, D.-M.D.-M.KwaiPING-HEI CHEN2020-01-132020-01-132012https://scholars.lib.ntu.edu.tw/handle/123456789/448102Thermal stress aware design for stacking IC with through glass viaconference paper10.1109/IMPACT.2012.64203032-s2.0-84874257723https://www.scopus.com/inward/record.uri?eid=2-s2.0-84874257723&doi=10.1109%2fIMPACT.2012.6420303&partnerID=40&md5=25e7f547f6ad388817c835a41955e48e