Influence of grinding process on semiconductor chip strength

Inst. of Appl. Mech., National Taiwan Univ.Wu, EnboaEnboaWuShih, I.G.I.G.ShihChen, Y.N.Y.N.ChenChen, S.C.S.C.ChenTsai, C.Z.C.Z.TsaiShao, C.A.C.A.Shao2007-04-192018-06-292007-04-192018-06-292002-05http://ntur.lib.ntu.edu.tw//handle/246246/2007041910021175application/pdf762093 bytesapplication/pdfen-USInfluence of grinding process on semiconductor chip strengthother10.1109/ECTC.2002.1008323http://ntur.lib.ntu.edu.tw/bitstream/246246/2007041910021175/1/01008323.pdf