Implementation of three-dimensional SOI-MEMS wafer-level packaging using through-wafer interconnections

Lin, Chiung-WenChiung-WenLinYang, Hsueh-AnHsueh-AnYangWang, Wei ChungWei ChungWangWEICHUNG WANG2019-10-282019-10-2820070960-1317https://scholars.lib.ntu.edu.tw/handle/123456789/428602Implementation of three-dimensional SOI-MEMS wafer-level packaging using through-wafer interconnectionsjournal article10.1088/0960-1317/17/6/014WOS:000246851400016