National Taiwan University Dept Chem EngnChiu, Jian-BinJian-BinChiuYu, Cheng-ChingCheng-ChingYuShen, Shih-HaurShih-HaurShen2006-11-142018-06-282006-11-142018-06-282003http://ntur.lib.ntu.edu.tw//handle/246246/2006111501244184In chemical mechanical polishing (CMP), a two-stage polishing strategy is often employed. A high removal rate (RR) is set at the initial stage, then a lower RR is employed to remove residual metal and extended to the over-polish stage. An analogy between the soft landing of a spacecraft and CMP operation is established and the CMP operation can be viewed as a minimum-time optimal control problem. Measurement uncertainties prevent direct implementation of bang-bang control law for the entire polishing process. Thus, a two-stage CMP operation procedure is devised to ensure robust operation while maintaining a high throughput.application/pdf1129176 bytesapplication/pdfen-USsoft landingminimum time problemchemical mechanical polishingdamasceneSTI process controljournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/2006111501244184/1/7421.pdf