Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates

Wu, R.W.R.W.WuTsao, L.C.L.C.TsaoChang, S.Y.S.Y.ChangJain, C.C.C.C.JainChen, R.S.R.S.Chen2012-10-242018-06-282012-10-242018-06-282011http://ntur.lib.ntu.edu.tw//handle/246246/243715en-USInterfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substratesjournal article10.1007/s10854-010-0281-xhttp://ntur.lib.ntu.edu.tw/bitstream/246246/243715/-1/158.pdf