Chen J.Z.Liu Z.Rumala Y.S.Sivco D.L.Gmachl C.F.JIAN-ZHANG CHEN2019-09-262019-09-26200600135194https://scholars.lib.ntu.edu.tw/handle/123456789/425219A compact packaging module for direct liquid cooling of room-temperature quantum cascade lasers is implemented. The light was coupled out of the hermetically sealed package through a mid-infrared fibre epoxy-bonded to the laser. The threshold current reduces by ?10%, compared to convectional substrate-side cooled lasers when using low boiling temperature (boiling point (b.p.)=34¢XC) 3M HFE-7000 coolant. No reduction was observed with high boiling point 3M FC-77 (b.p.=97¢XC) coolant. ? The Institution of Engineering and Technology 2006.journal article10.1049/el:200642772-s2.0-33646433763WOS:000237830000024https://www2.scopus.com/inward/record.uri?eid=2-s2.0-33646433763&doi=10.1049%2fel%3a20064277&partnerID=40&md5=eeff6e94b8053982df14375d0d3a1a6a