Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

Chang, S.Y.S.Y.ChangJain, C.C.C.C.JainChuang, T.H.T.H.ChuangFeng, L.P.L.P.FengTUNG-HAN CHUANG2012-10-242018-06-282012-10-242018-06-282011http://ntur.lib.ntu.edu.tw//handle/246246/243670en-USEffect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solderjournal article10.1016/j.matdes.2011.06.044http://ntur.lib.ntu.edu.tw/bitstream/246246/243670/-1/113.pdf