Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates

Wang Y.W.Lin Y.W.C. ROBERT KAO2019-11-272019-11-27200900262714https://www.scopus.com/inward/record.uri?eid=2-s2.0-60849105954&doi=10.1016%2fj.microrel.2008.09.010&partnerID=40&md5=76e83b2b2e19aae327dfd9a6eb4730d3https://scholars.lib.ntu.edu.tw/handle/123456789/432681Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substratesjournal article10.1016/j.microrel.2008.09.0102-s2.0-60849105954