Influence of glass transition temperature of underfill on the stress behavior and reliability of microjoints within a chip stacking architecture

Chang, J.-Y.J.-Y.ChangHuang, S.-Y.S.-Y.HuangLee, C.-C.C.-C.LeeChuang, T.-H.T.-H.ChuangChang, T.-C.T.-C.ChangTUNG-HAN CHUANG2020-05-122020-05-122015https://scholars.lib.ntu.edu.tw/handle/123456789/491966Influence of glass transition temperature of underfill on the stress behavior and reliability of microjoints within a chip stacking architecturejournal article10.1115/1.40303922-s2.0-84930196328https://www.scopus.com/inward/record.uri?eid=2-s2.0-84930196328&doi=10.1115%2f1.4030392&partnerID=40&md5=4ceb35fee89975d7871ac78b12835e35