Kuo, B.-H.B.-H.KuoTsai, D.-C.D.-C.TsaiHuang, Y.-L.Y.-L.HuangHsu, P.-C.P.-C.HsuChuang, T.-H.T.-H.ChuangTsai, H.-H.H.-H.TsaiShieu, F.-S.F.-S.ShieuTUNG-HAN CHUANG2020-05-122020-05-122018https://scholars.lib.ntu.edu.tw/handle/123456789/491951Effect of Au Addition on the Microstructure and Properties of Ag-4Pd Bonding Wiresjournal article10.1007/s11661-018-4841-72-s2.0-85050691817https://www.scopus.com/inward/record.uri?eid=2-s2.0-85050691817&doi=10.1007%2fs11661-018-4841-7&partnerID=40&md5=aae669f3f66e4bbd934e26b8b7748896