The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via)

Liao, M.-H.M.-H.LiaoChen, C.-H.C.-H.ChenLee, J.J.J.J.LeeChen, K.C.K.C.ChenJYH-JONE LEE2018-09-102018-09-102013http://www.scopus.com/inward/record.url?eid=2-s2.0-84898041415&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/378696The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via)conference paper10.1109/eMDC.2013.6756038