Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads

Chi, Chih-ChienChih-ChienChiChuang, Tung-HanTung-HanChuang2009-01-062018-06-282009-01-062018-06-282006http://ntur.lib.ntu.edu.tw//handle/246246/95955application/pdf605881 bytesapplication/pdfen-USIntermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu padsjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95955/1/97.pdf