Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints

Tsai C.M.Luo W.C.Chang C.W.Shieh Y.C.C. ROBERT KAO2019-11-272019-11-27200403615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-11344255513&doi=10.1007%2fs11664-004-0082-1&partnerID=40&md5=aaa6731835481f3efaba680171c381e0https://scholars.lib.ntu.edu.tw/handle/123456789/432721Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder jointsjournal article10.1007/s11664-004-0082-12-s2.0-11344255513