Ho C.E.Lin Y.L.Tsai J.Y.C. ROBERT KAO2019-11-272019-11-27200303681653https://www.scopus.com/inward/record.uri?eid=2-s2.0-0141989557&partnerID=40&md5=66a1dbc57d0e9a75e7f1752046f84aa5https://scholars.lib.ntu.edu.tw/handle/123456789/432722Chemical reaction in solder joints of microelectronic packagesjournal article2-s2.0-0141989557