C. E. HoY. L. LinJ. Y. TsaiC. ROBERT KAO2019-11-272019-11-27200303681653https://www.scopus.com/inward/record.uri?eid=2-s2.0-0141989557&partnerID=40&md5=66a1dbc57d0e9a75e7f1752046f84aa5https://scholars.lib.ntu.edu.tw/handle/123456789/432722Chemical Reaction in Solder Joints of Microelectronic Packagesjournal article10.6967/JCICE.200307.03872-s2.0-0141989557