Quantitative reliability analysis of electronic packages in consideration of variability of model parameters

Wu W.-F.Lin Y.-Y.Young H.-T.2019-07-242019-07-2420050780395786; 9780780395787https://www.scopus.com/inward/record.uri?eid=2-s2.0-33847326816&partnerID=40&md5=3a87ae131186a9e6cf45323ee7763736https://scholars.lib.ntu.edu.tw/handle/123456789/415047Quantitative reliability analysis of electronic packages in consideration of variability of model parametersconference paper2-s2.0-33847326816