Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al<inf>2</inf>O<inf>3</inf> with Sn interlayers

Liang, M.W.M.W.LiangHsieh, T.E.T.E.HsiehChang, S.Y.S.Y.ChangChuang, T.H.T.H.ChuangTUNG-HAN CHUANG2020-05-122020-05-122003https://scholars.lib.ntu.edu.tw/handle/123456789/492024Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al<inf>2</inf>O<inf>3</inf> with Sn interlayersjournal article10.1007/s11664-003-0229-52-s2.0-0141676003https://www.scopus.com/inward/record.uri?eid=2-s2.0-0141676003&doi=10.1007%2fs11664-003-0229-5&partnerID=40&md5=87cfa6df6547d12a872772f8d6d4ec71