Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads

Liu, Y.U.-C.Y.U.-C.LiuLin, W.-H.W.-H.LinLin, H.-J.H.-J.LinChuang, T.-H.T.-H.ChuangTUNG-HAN CHUANG2020-05-122020-05-122006https://scholars.lib.ntu.edu.tw/handle/123456789/492016Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu padsconference paper10.1007/s11664-006-0197-72-s2.0-32644433535https://www.scopus.com/inward/record.uri?eid=2-s2.0-32644433535&doi=10.1007%2fs11664-006-0197-7&partnerID=40&md5=8d5530354367967b19aa971a54f5a6d0