Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu Pads

Lin, H.-J.H.-J.LinChuang, T.-H.T.-H.ChuangTUNG-HAN CHUANG2020-05-122020-05-122006https://scholars.lib.ntu.edu.tw/handle/123456789/492012Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu Padsconference paper10.1007/s11664-006-0198-62-s2.0-32644450074https://www.scopus.com/inward/record.uri?eid=2-s2.0-32644450074&doi=10.1007%2fs11664-006-0198-6&partnerID=40&md5=b643cb0a8fb2b4162878c11b2fb9941f