2003-08-012024-05-18https://scholars.lib.ntu.edu.tw/handle/123456789/697329摘要：將具備不同功能(function)的電路整合製成單一晶片系統(system on chip, SOC)為現在學術界及產業界努力的重要目標。在達成SOC的目標之前，將若干具備部份功能的晶片整合在同一個封裝內以形成單一封裝系統(system on package, SOP)；各別晶片則成為一個次系統，並由封裝內的連線聯結。在達成SOC的目標之後，不同的晶片系統亦可整合在同一個封裝內以形成具有更高功能的SOP。本計畫擬研究以低溫共燒陶瓷 ( low temperature cofired ceramics, LTCC ) 多層架構的封裝技術建構SOP時的設計方法及可能遭遇的問題，據以擬定設計法則及發展相關技術。 本計畫擬分三年，分別研究製作於高介電係數多層電路基板上的高介電係數多層電容器、多層電感器、濾波器、多頻帶介質天線、寬頻帶介質天線、多層天線、傳輸線佈局、電磁干擾現象等，並開發出可行的設計原型。研究過程中並將探討這些元件微縮化的極限，期使整個SOP體積大幅縮減，更能符合電子產品的發展趨勢。研究方法包括軟體模擬、理論分析、硬體實作及實驗量測。 預期能夠將研究成果應用在實際的SOP電路<br> Abstract: System on chip (SOC) technology is a major goal of academic an industrial endeavor, which integrates different functional circuitries into one single chip. Before SOC can be accomplished, several chips with partial functions can be integrated into one package, thus form a system on package (SOP). Several SOCs can also be integrated into one SOP to serve multiple functions and achieve higher performance. In this project, low temperature cofired ceramics (LTCC) technology with layered structure is chosen for implementing SOP. Possible design approaches and difficulties will be explored to compile design rules and develop relevant technologies. This project will be conducted in three years to study layered capacitors, layered inductors, filters, multi-band dielectric resonator antennas, broad band dielectric resonator antennas, layered antennas, transmission line layout and electromagnetic interference in LTCC with high dielectric constant, feasible design prototypes will also be proposed. Components will be miniaturized utilizing layered structures of the LTCC to reduce the size of SOPs, which is another trend of electronics industries. Simulation, theoretic analysis, hardware prototyping and measurement will be applied in these studies. The research results are expected to be applied to practical SOP implementation, and satisfy current trend in communication and electronics industries. The analysis approach and design prototypes will be academically qualified and valuable. The participating graduate students are expected to acquire good training in simulation, theoretical derivation, programming, hardware prototyping and measurement. The experience gained from conducting this project shall promote them into high quality research and development engineers for the wireless communication industries.單一封裝系統低溫共燒陶瓷多層架構電容器電感器濾波器介質天線寬頻帶傳輸線佈局電磁干擾。system on package (SOP)low temperature cofired ceramics (LTCC)layered structurecapacitorinductorfilterdielectric resonator antennabroadbandtransmission line layoutelectromagnetic interference.