Novel Cu-RuNx composite layer with good solderability and very low consumption rate

Chuang, H.Y.H.Y.ChuangLin, C.H.C.H.LinChu, J.P.J.P.ChuC. ROBERT KAO2012-10-242018-06-282012-10-242018-06-282010https://www.scopus.com/record/display.uri?eid=2-s2.0-77955412522&origin=resultslist&sort=plf-f&src=s&sid=71011588b997c96b22b7221bdcbc0d09&sot=b&sdt=b&s=TITLE-ABS-KEY%28Novel+Cu-RuNx+composite+layer+with+good+solderability+and+very+low+consumption+rate%29&sl=98&sessionSearchId=71011588b997c96b22b7221bdcbc0d09&relpos=0en-USNovel Cu-RuNx composite layer with good solderability and very low consumption ratejournal article10.1016/j.jallcom.2010.05.1312-s2.0-77955412522http://ntur.lib.ntu.edu.tw/bitstream/246246/243861/-1/305.pdf