Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow

Key Chung C.Zhu Z.X.C. ROBERT KAO2019-11-272019-11-27201403615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-84925502794&doi=10.1007%2fs11664-014-3528-0&partnerID=40&md5=2bf3bca997c4e14cf4035f58ced0158dhttps://scholars.lib.ntu.edu.tw/handle/123456789/432615Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflowjournal article10.1007/s11664-014-3528-02-s2.0-84925502794