2011-08-012024-05-17https://scholars.lib.ntu.edu.tw/handle/123456789/694519摘要：微電子及微機械的元件尺寸大都為次微米範圍，且皆含有多個異質材料的界面，使得元件表面的界面處常有應力集中的現象並導致裂紋常於材料界面處產生，這些界面裂紋受到外界因素的影響及作用（外力、溫度、濕度、電磁場）進而產生擴展，使得可靠度降低及元件的功能失效而無法正常運作。這些幾何尺寸介於次微米及奈米範圍的結構元件的力學行為及破壞特性，通常與其巨觀材料有所不同。然而次微米元件界面相關的微觀力學分析及破壞探討，仍有許多待研究之處，而這也是本研究計畫的主要研究目標之一。 以目前而言，次微米尺寸的平面結構薄膜機械性質實驗量測大都以薄膜張力測試以及壓痕測試為主，如何以實驗的方式直接加載於次微米的三維立體結構，而達到結構元件力學特性的定量實驗量測，亦是一個具有挑戰性的研究課題。本研究計畫也將從實驗技術的精進著手，擬以奈米壓痕試驗機為基礎，發展一套能直接量測次微米尺寸元件的微觀機械性質及力學特性，並與材料巨觀行為作分析比較，計畫中亦將開發一種能量測微米元件全域變形的高解析度散斑新技術。經由微納米級的理論分析及實驗量測方法的建立，應可幫助我們了解材料的微觀力學行為及機械特性。 <br> Abstract: The microelectronic and micromechanical devices consist of dissimilar elements with submicron dimensions, and most contain many bi-material interfaces. It is well known that stress concentrates at the free edge of an interface in a bi-material due to deformation mismatch and, hence, the interface edge is the most common site of crack initiation. However, the effect of the submicron structure on the stress distribution and fracture behavior near the interface remains unclear. The mechanical behavior at the submicron-to-nanometer scales is greatly different from that of bulk materials and is dependent on not only their external geometry (or physical dimensions) but also internal structure. One of the main purposes of this project is to understand the material behavior and mechanics of crack initiation at an interface edge in submicron thick elements under loadings. The material properties of thin films with submicron thickness have been extensively evaluated by experimental methods such as film tensile tests or indentation tests. Experimentally, it is a challenging task to efficiently apply a mechanical load to a component and quantitatively measure its mechanical behavior in submicron scale. In this sub-project, a novel testing method that utilizes a nanoindenter for quantitative evaluation of the mechanical properties of a device in a submicron dimensions will be used. Furthermore, we will develop a high-resolution digital speckle method with the emphasis on micro/nano measurements. It is noted that this experimental method is capable to measure the full field distributions of deformation.微奈米尺度材料機械性質裂縫破壞行為壓痕試驗界面Micro-Nano ScaleMaterial Mechanical PropertyCrackFracture BehaviorIndentation Test.Interface