Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004)

Cheng, M. D.M. D.ChengChang, S. Y.S. Y.ChangYen, S. F.S. F.YenChuang, T. H.T. H.ChuangTUNG-HAN CHUANG2020-05-122020-05-1220040361-5235https://scholars.lib.ntu.edu.tw/handle/123456789/492093Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004)journal article10.1007/s11664-004-0252-1WOS:000222735000015