Optimal wiring topology for electromigration avoidance considering multiple layers and obstacles

Jiang, I.H.-R.I.H.-R.JiangChang, H.-Y.H.-Y.ChangChang, C.-L.C.-L.ChangHUI-RU JIANG2020-06-112020-06-112010https://scholars.lib.ntu.edu.tw/handle/123456789/497934Optimal wiring topology for electromigration avoidance considering multiple layers and obstaclesconference paper10.1145/1735023.17350642-s2.0-77952279590https://www.scopus.com/inward/record.uri?eid=2-s2.0-77952279590&doi=10.1145%2f1735023.1735064&partnerID=40&md5=2f4300b544c929db3b3df01b8cd04b71