Li C.C.Drymiotis F.Liao L.L.Dai M.J.Liu C.K.Chen C.L.Chen Y.Y.Kao C.R.Snyder G.J.C. ROBERT KAO2019-11-272019-11-27201501968904https://www.scopus.com/inward/record.uri?eid=2-s2.0-84926625838&doi=10.1016%2fj.enconman.2015.03.089&partnerID=40&md5=13834c047d8ac2e9f058b8a1a4556f09https://scholars.lib.ntu.edu.tw/handle/123456789/432606Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressingjournal article10.1016/j.enconman.2015.03.0892-s2.0-84926625838