Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers

Liang, M. W.M. W.LiangHsieh, T. E.T. E.HsiehChang, S. Y.S. Y.ChangChuang, T. H.T. H.Chuang2009-01-062018-06-282009-01-062018-06-282003http://ntur.lib.ntu.edu.tw//handle/246246/95940application/pdf221204 bytesapplication/pdfen-USThin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayersjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95940/1/82.pdf