CHIEN-CHUNG LINHuang C.-YKu K.-NChou K.-WChen T.-HChang P.-CChen Y.-FLin C.-YWang C.-CLee C.-SHsu C.-HChen S.-C.2023-06-092023-06-092020https://www.scopus.com/inward/record.uri?eid=2-s2.0-85098708135&doi=10.1109%2fOECC48412.2020.9273651&partnerID=40&md5=26c6984a0c6581b91ae9fc4dc00f83d3https://scholars.lib.ntu.edu.tw/handle/123456789/632182In this paper, we demonstrated the hybrid silicon photonics platform developed in ITRI. The functions of this platform include full-wafer high speed photonic measurement, active and passive device fabrication, and the photonic packaging technology. © 2020 IEEE.fiber array couplers; full-wafer measurement; high speed modulator; high speed photodetector; laser sub-assembly; photonic package; silicon photonics[SDGs]SDG9Photonic devices; Silicon wafers; Active and passive device; High Speed; Hybrid integration; Photonic packaging; Silicon photonicsconference paper10.1109/OECC48412.2020.92736512-s2.0-85098708135