2014-01-012024-05-17https://scholars.lib.ntu.edu.tw/handle/123456789/681919摘要：毫米波頻譜是寶貴的頻譜資源，技術上面臨不少挑戰，在電路、組件及天線的設計與製造上需要更高的精確定，在系統整合上也尚乏標準構裝環境，過去較少開發。本計畫目的就在於發展毫米波及系統構裝技術，以達到未來對高速通訊的高規格需求。 因應現代高度整合數位產品高儲存容量、個人化及移動性需求，IEEE 802已組成60GHz Wireless Gigabit工作小組(IEEE802.11ad)；在毫米波不需使用許可頻段，如FCC 47 CFR 15.255規定的57-64 GHz，可提供7 GHz以上頻寬實現高速通訊，在HDTV、MRI及娛樂租售販賣機(Kiosk)等領域，將出現許多創新應用與龐大商機。台大團隊有必要在既有優勢下精益求精，研發毫米波多通道收發系統的關鍵元組件，並研究與WPAN/WLAN/WiMAX相容之毫米波無線通訊系統應用。 此一系統將挑戰的技術瓶頸為高達20%頻寬的60GHz天線、低耗電及高線性度晶片、與模組整合構裝，將積極與無縫連網分項整合利用4x4 MIMO (4收4發)技術，展現28Gbps的超高速率之無線訊號傳輸性能。重點研發工作將包括 (1) MMIC元件研發、(2) 系統構裝(SiP)與電磁相容、(3) 縮小化多天線、並積極參與國際標準制定。 本計畫同時將積極成立跨校產學聯盟創新研發平台，積極與產業界合作，共同吸引優秀人才投入創新研究，弭平產學隔閡，推動創業核心的工程實作文化，並激發先進研發課題。 <br> Abstract: The millimeter-wave spectrum represents a precious natural resource but comparatively unexploited since it also faces with higher technical challenges, such as more demanding accuracy for the design of circuits, components, and antennas, and lack of well established packaging platform for the system integration. This subproject aims at the research and development of millimeter-wave and system-in-package technologies to meet the needs for emerging dense wireless communication and radar systems in the modern world. In order to fulfill the requirements of mass storage, personalization, and mobility in today’s highly integrated digital products, the IEEE 802 standard organization has formed a 60-GHz Wireless Gigabit group to promote 802.11ad. Using the unlicensed band in millimeter-wave spectrum, e.g., 57-64 GHz by FCC 47 CFR 15.255, the multi-Gpbs high-speed wireless communications with 7-GHz bandwidth has emerged innovative applications and great opportunities in various areas, such as HDTV/3DTV, medical equipments, and Kiosk systems. NTU EM group has been globally leading in the monolithic millimeter-wave integrated circuit (MMIC) and system integration, and also actively involved in the IEEE 802 standardization process. To keep Taiwan’s momentum, the group is mandated to develop the key components in the millimeter-wave multi-channel transceiver system, including the Gbps wireless system on chip (SoC) and system in package (SiP) for higher integration and lower power consumption and the exploration of system applications with WPAN/WLAN/WiMax compatibility. The goal of this project is to demonstrate an ultra-high speed of 28 Gbps wireless transmission using 4 by 4 MIMO (4 input channels with 4 output channels) technique. The project will tackle several technical challenges, such as 60-GHz antennas with 20% bandwidth, transceiver IC chips with low power consumption and high linearity, module packaging/integration, and the study of multi-path environment at 60 GHz. Major research topics will cover (1) MMIC design, (2) system in package and EMC, (3) miniaturized multi-antennas, 60-GHz MIMO design in cooperation with the subproject 4, and among others, aggressive participation in the IEEE standard organization. In addition, the project will actively collaborate with leading universities and industries to form a consortium as a platform for innovative R&D. The missions are to attract more young talents working on innovative research, to smooth the gap between industry and academia, to promote the entrepreneurship centric engineering culture, and to trigger the formation of cutting-edge technology.毫米波積體電路(MMIC)系統構裝(SiP)多天線系統無線通訊IEEE標準Monolithic Millimeter-wave Integrated Circuits (MMIC)System-in-Package (SiP) Multi-AntennasWireless CommunicationTransceiverIEEE 802.11ad