公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2022 | The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology | Yen C; Chang S; Chen K; Feng Y; Chen L; Liao B; Lee M; Chen S; Liao M.; MING-HAN LIAO | IEEE Transactions on Electron Devices | |||
2021 | Performance Improvement by Double-Layer a-IGZO TFTs with a Top Barrier | Chiu J; Li S; Lee M; Yen C; Chen T; Chou C; CHEE-WEE LIU | IEEE Journal of the Electron Devices Society | |||
2022 | Technological and economic perspectives of membrane capacitive deionization (MCDI) systems in high-tech industries: From tap water purification to wastewater reclamation for water sustainability | Chen T.-H; Yeh K.-H; Lin C.-F; Lee M; Hou C.-H.; CHIA-HUNG HOU | Resources, Conservation and Recycling |