Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
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2021 | Electromigration improvement by graphene on Cu wire for next generation VLSI | Huang J.Z.; Chang H.H.; Huang K.P.; Lee O.H.; Chiu W.L.; Jian H.J.; Huang K.C; Lo W.C.; Hu J.S.; Wu C.I. | 2021 International Conference on Electronics Packaging, ICEP 2021 |