Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
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2012 | Thermal stress aware design for stacking IC with through glass via | Chien, J.-H.; Yu, H.; Lung, C.-L.; Chang, H.-C.; Tsai, N.-Y.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN | International Microsystems, Packaging, Assembly, and Circuits Technology Conference |