公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2011 | Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints | Liu, Chao Sheng; Ho, Cheng En; Peng, Cheng Sam; C. ROBERT KAO | Journal of electronic materials | 32 | 28 |