Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
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2011 | Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints | Liu, Chao Sheng; Ho, Cheng En; Peng, Cheng Sam; C. ROBERT KAO | Journal of electronic materials | 32 | 28 |